Training on SECS-I, SECS-II, HSMS, GEM, GEM300 and Interface A for equipment, factory and software teams.
Introduction
半导体行业非常注重智能制造，早在上世纪90年代初 SEMI 发布设备自动化软件标准，极大推动半导体设备与主机厂之间的智能通讯。SEMI SECS/GEM系列连接标准，定义自动化设备与主机厂之间的通讯。随着生产300mm硅片的自动化要求，半导体厂需要从每个设备单元相互传递物料，SEMI 发布的GEM300标准帮助工厂自动化管理物料运输、设置设备制程、跟踪物料。国内外半导体厂均要求生产设备满足GEM300标准。 SEMI集成电路设备开发培训课程分为机械交互类课程和自动化软件系列课程。
从2010年起，国外半导体行业意识到通过分析设备和制程的数据能够优化生产，进而开始要求设备商采用EDA解决方案。SEMI EDA/Interface A (Equipment Data Acquisition)是集合工厂与设备之间数据进而优化通讯的一系列标准。工厂利用EDA收集设备数据、分析数据，寻找最优方法提高生产力、提高产品质量、减少浪费。
SEMI 自动化软件系列标准培训课程旨在为半导体行业的专业人员提供一个机会理解 SEMI 软件标准如何应用于工厂端与设备端的智能制造。
Training objectives
- 基本掌握SECS/GEM标准，掌握自动化设备与主机厂之间的通讯。
- 将HSMS 传输协议、SECS-Ⅱ、GEM 300等标准集合进设备，满足SEMI标准中的验证试验。
- 利用EDA/Interface A收集设备数据、分析数据，寻找最优方法提高生产力。
Target audience
- 软件工程师、架构师
- 半导体工厂工艺工程师
- 自动化工程师
- 统计分析师
- 建模分析师
- 工业工程师
- 生产控制工程师
- 维护工程师
- 半厂务工程师
- 传感器集成专家
- 良率改进部门等
Course content
| 主要内容 | Description | |
|---|---|---|
| SECS | ||
| SEMI E4 | Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I) | |
| SEMI E5 | Specification for SEMI Equipment Communications Standard 2 Message Content (SECS-II) | SEMI Equipment Communications Standard 2 Message Format (SECS-II) |
| SEMI E37 | Specification for High-Speed SECS Message Services (HSMS) Generic Services | HSMS 传输协议（High-Speed SECS Message Services） |
| SEMI E39 | Object Services Standard: Concepts, Behavior, and Services | |
| GEM | ||
| SEMI E30 | Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM) | GEM |
| GEM 300 | ||
| SEMI E40 | Standard for Processing Management | |
| SEMI E87 | Specification for Carrier Management (CMS) | |
| SEMI E90 | Specification for Substrate Tracking | |
| SEMI E94 | Specification for Control Job Management | |
| SEMI E116 | Specification for Equipment Performance Tracking (EPT) | |
| SEMI E148 | Specification for Time Synchronization and Definition of the TS-Clock Objec | |
| SEMI E157 | Specification for Module Process Tracking (MPT) | |
| SEMI E172 | Specification for SECS Equipment Data Dictionary (SEDD) | |
| SEMI E173 | Specification for XML SECS-II Message Notation (SMN) | |
| CIM | ||
| SEMI E81 | Provisional Specification for CIM Framework Domain Architecture | |
| SEMI E86 | Provisional Specification for CIM Framework Factory Labor Component | |
| SEMI E96 | Guide for CIM Framework Technical Architecture | |
| SEMI E102 | Provisional Specification for CIM Framework Material Transport and Storage Component | |
| EDA / Interface A | ||
| SEMI E120 | Specification for the Common Equipment Model (CEM) | EDA Freeze I(1105) |
| SEMI E125 | Specification for Equipment Self Description (EqSD) | |
| SEMI E128 | Specification for XML Message Structures | |
| SEMI E132 | Specification for Equipment Client Authentication and Authorization | |
| SEMI E134 | Specification for Data Collection Management | |
| SEMI E138 | Specification for XML Semiconductor Common Components | |
| SEMI E164 | Specification for EDA Common Metadata | |
| SEMI E147 | Guide for Equipment Data Acquisition (EDA) | |
| SEMI E145 | Classification for Measurement Unit Symbols in XML | |
| SEMI E179 | Specification for Protocol Buffers Common Components |